Patent family
Method of Fabricating Electrode Structures on a Substrate
CN102456482B
Method for Manufacturing a Substrate Electrode Structure
基板电极结构的制造方法
Application number: CN2010105320402A
- Filing date
- 2010-10-27
- Publication date
- 2014-12-03
- Grant date
- 2014-12-03
Legal status: Active
Abstract
The present invention provides a method for manufacturing a substrate electrode structure. The method comprises providing a substrate having a patterned metal layer defining an electrode region, wherein a protective glue covers the patterned metal layer, and an electrode layer is formed in the electrode region. A filling step is performed to deposit a nano-oxide on the electrode layer to fill the entire electrode region.
I407579
Application number: TW099130285A
- Filing date
- 2010-09-08
- Publication date
- 2013-09-01
- Grant date
- 2013-09-01
Abstract
Methods for fabricating electrode structures on a substrate are presented. The fabrication method includes providing a substrate with a patterned metal layer thereon, defining an electrode area. A passivation glue is formed on the patterned metal layer. An electrode layer is formed in the electrode area. A filling process is performed to deposit nano metal oxides on the electrode layer to extensively fill the entire electrode area.
US 8,470,150 B2
Method of Fabricating Electrode Structures on Substrate
Application number: US13085452
- Filing date
- 2011-04-12
- Publication date
- 2013-06-25
- Grant date
- 2013-06-25
Legal status: Active
Abstract
Methods for fabricating electrode structures on a substrate are presented. The fabrication method includes providing a substrate with a patterned metal layer thereon, defining an electrode area. A passivation glue is formed on the patterned metal layer. An electrode layer is formed in the electrode area. A filling process is performed to deposit nano metal oxides on the electrode layer to extensively fill the entire electrode area.